Lead mechanical, thermal, and power design and validation for GDC rack infrastructure, accommodating next-generation advanced GPUs, including platforms such as NVIDIA Blackwell, Rubin, and future high-density AI accelerators.
Analyze power consumption and thermal output of new components (e.g., servers, ToRs, switches, HSM, etc.) to determine impact on the existing rack designs, specifically addressing the shift to liquid-cooled requirements.
Work closely with Original Equipment Manufacturer (OEMs), Product and Engineering teams to analyze their specific Hyperscale Graphics eXtension (HGX).
Calculate rack power budgets and density limits, ensuring designs accommodate high-voltage requirements without exceeding infrastructure capacity.
Model and validate airflow for mixed environments, including the integration of liquid-to-air sidecar heat exchangers.
Minimum qualifications:
Bachelor's degree in Computer Science, Electrical Engineering, a related technical field, or equivalent practical experience.
3 years of experience with interactions between hardware and software at the system level.
Preferred qualifications:
Master's degree or PhD in Computer Science, Electrical Engineering, a related technical field, or equivalent practical experience.
Experience with liquid cooling technologies (e.g., DLC, sidecars) and their application in data center environments.
Experience with server hardware from Dell (PowerEdge), HPE, and NVIDIA (HGX/NVL platforms).
Experience with thermal modeling or Computational Fluid Dynamics (CFD) software to predict hotspot formation in high-density racks.
Familiarity with high-power electrical standards and facility interfaces for liquid-cooled hardware.
