Who We Are
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
What We Offer
Location:
Bangalore,IND
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our
benefits
.
Educational Qualification :
M.E./M.Tech/Ph.D. in Mechanical, Chemical Engineering or Ph.D. in Physics
Key Responsibilities
Drive
multi‑physics modeling and simulation
for next‑generation,
energy‑efficient compute platforms
leveraging
advanced semiconductor packaging technologies
.
This role will play a critical part in
silicon–package–system co‑design
, enabling architecture tradeoffs and influencing early design decisions for high‑performance CPUs, GPUs, AI accelerators, and heterogeneous compute systems.
CAE & Multi‑Physics Modeling
Develop and own
thermal, mechanical, and coupled multi‑physics models
at:
Die level
Package level (2.5D / 3D)
Board and system level
Perform
architecture and packaging trade‑off studies
to optimize:
Power efficiency
Thermal performance
Reliability and cost
Energy‑Efficient Compute Enablement
Analyze
power–thermal interactions
for high‑density compute workloads
Support early‑stage
energy per operation (E/op)
and power efficiency targets
Model effects of
DVFS, power gating, workload power profiles
, and hot‑spot behavior
Advanced Packaging Focus
Lead CAE efforts for
advanced packaging technologies
, including:
Chiplet‑based architectures
2.5D / 3D integration
Fan‑Out packaging
HBM and advanced memory integration
Assess
TSV stress, warpage, CTE mismatch
, and thermo‑mechanical reliability risks
Support package architecture definition and design guidelines
Define modeling strategy
Set energy efficiency metrics
Influence product architecture
Interface with executives and partners
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Yes, 10% of the Time
Relocation Eligible:
Yes
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
